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Moldtek Packaging announces capex worth Rs 125 cr in FY23

Thursday, 28 Jul 2022
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Moldtek Packaging is planning capex worth Rs 125 crore during FY23 including new locations and in all segments. 
 
This is two-and-a-half times of last five years average capex per annum. The company will add 4,700 tpa capacity will at Sultanpur and Daman units. It will add 2,600 tpa will at Daman, Vizag, Hyderabad and Kanpur units. 
 
Apart from this, 2,000 tonne IBM unit will be setup at Sultanpur, Hyderabad. The project will also see doubling of printing capacity to 4.5 crore lables per month. 
 
The per month capacity of tool room will be increased from four moulds in 2021 to eight moulds in 2023. 
 
Moreover, the Board has decided to set up a second plant at Daman with robotic IML facilities to produce Food & FMCG IML-containers for the increasing demand in western region. This plant will also add IBM products later. 
 
Under the IBM project, building for Phase-1 is constructed and interiors are underway. 
 
A major order for national wide OTC pharma products has been received in two pack sizes that is expected to completely fill the IBM pilot plant capacity right from October/November 2022.

 

 
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