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PM Modi lays foundation stone of three semiconductor projects worth Rs 1.25 trln

Thursday, 14 Mar 2024
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Prime Minister Narendra Modi on 13 March, 2024 virtually laid the foundation stone of three semiconductor projects worth about Rs 1.25 trillion. Two of the three facilities are located in Gujarat, whereas one is based in Assam, and are being incentivised under the India Semiconductor Mission.

The projects are the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, the Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam, and an OSAT facility in Sanand in Gujarat.

The Prime Minister said that these projects will help India to become a global semiconductor hub, and the facilities will foster innovation in the country, and help move towards achieving milestones in Industry 4.0. Union Minister for Railways, Communications, Electronics and IT Ashwini Vaishnaw informed that the Dholera plant was expected to start production by the end of 2026.

India’s first semiconductor fabrication facility will be set up by Tata Electronics in partnership with Taiwan’s Powerchip Semiconductor Manufacturing Corporation (PSMC) at an estimated cost of Rs 91,000 crore. A dedicated water supply will be provided through a Narmada river canal to the region.

The OSAT facility in Morigaon, Assam will be developed by Tata Electronics will cater to electric vehicles, automotive, mobile phones, and power devices. The Rs 7,500-crore OSAT facility at Sanand will be set up by CG Power and Industrial Solutions under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP).

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